MacDonald, Brendan D.Rosen, Marc A.Chakraborty, Soma2017-07-122022-03-292017-07-122022-03-292017-04-01https://hdl.handle.net/10155/775The study investigates the cooling requirements for the Intel Xenon Processor and the Intel Core i7-900 Processor using diffusion based evaporation of sessile droplets. An analytical model is developed to determine the capacity of a single layer of droplets to provide sufficient cooling. It is found that a single layer can provide sufficient cooling for the processors with tiny droplets. A numerical model is developed to analyze a tiered system that fits within the space restrictions corresponding to the current heat sinks with larger droplets and fewer of them. The results of the numerical modelling work found that a minimum of 41 posts connecting each of the tiers were required to cool the Xenon Processor and 42 posts for the Core i7-900 Processor. It was also found that a minimum of 3 tiers were required for the Xenon Processor, with a droplet radius of 2 mm, and 4 tiers for the Core i7.enEvaporative coolingSessile dropletsMicroprocessorsEvaporationThermal managementThesis